Xennia Technology introduces industrial inkjet printing solutions to US
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Xennia Technology introduces industrial inkjet printing solutions to US market at Pack Expo 2010
18 October 2010
Xennia, the world’s leading industrial inkjet solutions provider, will demonstrate its robust XenJet inkjet module range and versatile industrial inkjet solutions for packaging applications at Pack Expo, Chicago, USA on October 31st - November 3rd 2010. Just-in-time customised digital package production allows reduced inventories and fast response to market demands.
Xennia will showcase its XenJet print engine, fluid control and print software modules – the key elements of any reliable inkjet system – for use in applications such as flexible, box, carton and rigid package printing. The Xennia Sapphire inkjet printing system will demonstrate an example configuration of these modules using XenInx Diamond high performance UV cure ink to print onto a range of packaging substrates including examples of variable data printing (VDP).
Xennia’s innovative product portfolio offers solutions for a vast array of industrial markets. Specifically for packaging applications, the Xennia Aquamarine printing system is targeted at high quality, multi-colour batch printing of EPS fishboxes, chill boxes, cartons and other secondary packaging. The Aquamarine features high speed, single pass printing and full variable data capability with a 4.7” (120mm) print height and print speed of up to 1,800 boxes per hour. Xennia’s new XenInx Onyx ink show excellent decorative properties and allows digital printing of metallic effects onto packaging.
“Pack Expo is a key show and ideal for showcasing Xennia’s proven XenJet inkjet module technology for packaging applications,” says Dr Alan Hudd, Xennia’s Managing Director. “Xennia’s industrial inkjet solutions are flexible and economical for short runs, requiring minimal set up time and cost compared with conventional printing. This allows packaging printers to reduce their inventory and respond quickly to market demands with ‘just-in-time customisation’. Xennia’s attendance at Pack Expo will provide the opportunity for OEMs to experience these benefits of digital technology, and understand how to integrate them into their existing systems.”
