Events
Pack Expo 2010
31 October - 3 November 2010 | Chicago IL, USA
Xennia's stand will showcase the XenJet inkjet module range, allowing packaging OEMs to configure reliable printing solutions and bring them to market rapidly. Combined with the XenInx high performance specialist ink range, Xennia's modules provide a compelling solution for companies looking to introduce inkjet technology into their business. Xennia's Sapphire XY inkjet printing system will demonstrate an example configuration of these modules printing onto a range of packaging substrates using variable data printing.
The Xennia booth will be located in the Lakeside Lower hall at stand 8511, and Xennia's team would be pleased to meet you and discuss your requirements.
Please use the form below to book a meeting with one of our sales team.

